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Original name record: 深圳市兆兴智能有限公司

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1 indexed patent records

№ CN121394193AInvention
Active

一种电子元件制备参数优化方法及系统

本发明涉及电子元件制造技术领域，解决了因热应力失配导致界面接触电阻反弹升高的技术问题，尤其涉及一种电子元件制备参数优化方法及系统，包括以下步骤：在电极材料表面通过动态调节金属与陶瓷的流量比，生成热膨胀系数连续变化的梯度层；基于金属与陶瓷浓度分布函数计算用于消除界面热应力的目标热膨胀系数，原位监测梯度层的实际热膨胀系数。本发明通过金属/陶瓷前驱体动态流量控制实现成分连续过渡，实现金属至陶瓷组分的连续渐变，使热膨胀系数沿厚度方向平滑过渡，从源头阻断因材料膨胀差异引发的内部应力积累；并结合动态沉积调控，确保任意位置的热膨胀梯度低于临界阈值，避免热循环中应力集中导致的剥离或裂纹。

❖深圳市兆兴智能有限公司吴红伟; 何元发; 薄松; 程云§ 2/10 ClaimsH01G 11/84 (2013.01), G16C 60/00 (2019.01), G01D 21/02 (2006.01) +629