一种厚铜任意层互连电路板及其制作方法
本发明公开了一种厚铜任意层互连电路板及其制作方法,所述厚铜任意层互连电路板包括至少四层厚铜层,每一层厚铜层均是由一张芯板上的两面线路铜层组成,且每一张芯板上的两面线路铜层上下重叠并通过导通孔连通,且任意厚铜层之间通过导通孔连通。本发明和方法实现了厚铜和任意层互连的要求,采用一张芯板中上下两层重叠的线路图形实现了厚铜的要求,并采用任意层互连工艺实现了重叠的线路连通和厚铜层之间的连通,尤其适用于线圈的绕线和通孔任意层互连的结构。
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