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Original name record: 梅州智科电路板有限公司

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1 indexed patent records

№ CN121389969AInvention
Active

一种耐腐蚀电路板柱连结构滑丝失效预测方法

本发明公开了一种耐腐蚀电路板柱连结构滑丝失效预测方法，通过多传感器网络采集电路板结构在温度、湿度、振动等多环境应力下的多模态运行数据，并进行滤波、归一化和特征提取，生成结构化的多物理场耦合特征向量；结合有限元仿真与材料老化实验，构建结构应力、弹性模量退化及摩擦系数等多物理场信息的时序特征集；基于材料微观损伤机制，利用支持向量回归等方法建立滑丝趋势特征与损伤度的映射，并将其输入至具有在线自适应能力的长短时记忆网络进行动态预测，本发明实现了滑丝失效趋势的高精度、在线评估，并输出带空间定位与失效路径解释的预测结果，有效提升了电子设备的预防性维护决策能力和结构失效早期预警水平。

❖梅州智科电路板有限公司周旋; 周志宁; 侯东晓§ 1/10 ClaimsG06F 30/398 (2020.01), G16C 60/00 (2019.01), G06F 18/15 (2023.01) +1310