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珠海方正科技多层电路板有限公司

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№ CN122995048AInvention
Unknown

一种印刷电路板盲孔填孔电镀加工方法

本申请涉及印刷电路板制造技术领域，具体涉及一种印刷电路板盲孔填孔电镀加工方法。本申请提供了一种印刷电路板盲孔填孔电镀加工方法，本申请通过孔壁保留导电层、孔底露出底层压合铜的结构，使填孔电镀铜与底层压合铜实现同材质无中间层的直接冶金键合，有效减小信号传输损耗与阻抗波动，提升高频高速信号传输质量。去除孔底中间层后露出的新鲜压合铜面，优化了盲孔内部的电流分布与铜离子沉积均匀性，有效降低盲孔内空洞、凹陷、针孔等缺陷的发生率，提升填孔平整度。采用紫外激光冷加工方式实现孔底铜层去除，热影响范围小，可控制底层压合铜层的损耗程度；激光光斑与盲孔孔径匹配设计，仅作用于孔底区域，不损伤孔壁导电层。

❖珠海方正科技多层电路板有限公司; 珠海焕新方正科技有限公司昝贵平; 周国新; 周斌; 向铖; 张亚; 潘松林Oct 27, 2026§ 1/8 ClaimsH05K 3/42 (2006.01), H05K 3/22 (2006.01)