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Original name record: 中科寒武纪科技股份有限公司

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1 indexed patent records

№ CN121351752AInvention
Active

封装结构、装置、板卡及布局集成电路的方法

本披露提供封装结构、集成电路装置、板卡及在封装结构的晶片上布局集成电路的方法。在晶片上的系统区域芯片贴装片上系统；在晶片上的存储区域芯片贴装内存；在晶片上的电容区域芯片贴装多个电容器。所述电容区域为所述系统区域及所述存储区域以外的畸零区域。

❖中科寒武纪科技股份有限公司请求不公布姓名; 请求不公布姓名; 请求不公布姓名§ 4/32 ClaimsG06F 30/392 (2020.01), H10B 80/00 (2026.01), H10W 44/00 (2026.01) +17