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合肥芯投微电子有限公司

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№ CN122993659AInvention
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高Q值和机电耦合系数的声表面波元件及其制备方法

本发明公开了一种高Q值和机电耦合系数的声表面波元件及其制备方法，属于集成电路器件制造技术领域。本发明在现有技术的基础上，使第一电极指膜与第二电极指膜的汇流条重叠区域与电极指直接相连，以优化叉指换能器的叠层结构，增加了有效导电接触面积，同时减少了因键合不良产生的非导电杂质或微小空隙，提升两层金属膜之间的键合效果，改善叉指换能器表面物理与化学状态，从而减小了两层金属膜之间的阻抗问题。由于叉指换能器表面阻抗减小，良好的键合效果形成更连续、稳定的金属晶体结构，减少了电子散射，降低电阻率，因此产品的Q值和机电耦合系数得到了明显的提升，同时保留叉指换能器在末端的激励效应，阻断横向模式波纹的产生。该结构相比于现有技术，能完全应用于实际工艺生产，得到性能优良、可靠性更高的声表面波产品。

❖合肥芯投微电子有限公司郑晶晶; 李良伟; 韩笑颜; 邱鲁岩; 刘敬勇Oct 27, 2026§ 1/10 ClaimsH03H 9/25 (2006.01), H03H 9/64 (2006.01), H03H 9/145 (2006.01) +1