一种PCB板的化学沉锡方法及沉锡溶液
本发明属于印制电路板制造技术领域,具体的说是一种PCB板的化学沉锡方法及沉锡溶液,该方法及溶液采用电偶置换与自催化还原双重机制,通过引入还原剂与铋离子,在PCB板铜焊盘上沉积形成锡铋合金层。所述沉锡溶液包含二价锡盐、酸性组分、络合剂、还原剂、铋盐及抗氧化剂。本申请有效提高了锡层厚度、致密性及均匀性,抑制了IMC生长,提升了PCB板焊盘的可焊性、抗氧化性能和长期可靠性。
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