半导体制造装置、贴装位置的校准方法、芯片贴装方法以及半导体器件的制造方法
本公开提供能够进行半导体制造装置中的裸芯片的准确的贴装的技术。半导体制造装置具备:保持基板的载置部;贴装头,其能够在前端选择性地安装第一计测部件以及筒夹的某一方;驱动部,其使所述载置部或者所述贴装头移动或者升降或者旋转;以及控制装置,其决定裸芯片的贴装位置,所述控制装置构成为根据使安装有所述第一计测部件的所述贴装头移动而计测出的头位置与向所述驱动部的指令位置的差,算出所述贴装头的移动距离的修正值。
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