元の名称記録: ROHM CO., LTD.

A driving device includes a transmission wave signal generation circuit configured to generate a transmission wave signal, and a driving circuit configured to drive an ultrasonic oscillation element based on the transmission wave signal. The driving circuit has an initial driving sequence in which the driving circuit generates the transmission wave signal at an initial frequency, a first transition sequence in which the driving circuit generates the transmission wave signal during its transition from the initial frequency to a first frequency, and a second transition sequence in which the driving circuit generates the transmission wave signal during its transition from the first frequency to a second frequency. The initial frequency and the second frequency are closer than the first frequency, to the resonance frequency of the ultrasonic oscillation element. The first transition sequence is allotted a longer time than the time allotted to the second transition sequence.

An autonomous moving apparatus identifies a first attraction signal that is output from a first target object as an attraction signal, and causes a moving object to move, based on an incoming direction of the first attraction signal. When a position of the moving object relative to the first target object satisfies a predetermined condition, the attraction signal is switched from the first attraction signal to a second attraction signal that is output from a second target object, and the second attraction signal is identified as the attraction signal. An operation control unit causes the moving object to move, based on an incoming direction of the second attraction signal.

A signal transmission device includes a first die, a second die, and a third die that transmits a signal between the first and second dies while isolating between them. The third die includes a first isolating device and a second isolating device. In a first operation mode, a rising edge and a falling edge in an input pulse signal are transmitted from the first die via the first and second isolating devices to the second die. In a second operation mode, a first data signal and a first clock signal are transmitted from the first die via the first and second isolating devices to the second die.

A semiconductor device includes: a semiconductor element; a support member; a bonding layer interposed between the semiconductor element and the support member; and a sealing resin that covers the semiconductor element and at least a portion of the support member, wherein the bonding layer is a layer in which a layer containing first metal and a layer containing second metal are integrated without going through a molten state, and wherein the support member includes a first surface facing in a thickness direction and facing a side on which the semiconductor element is located, and a plurality of first recesses located outside the bonding layer and recessed from the first surface when viewed along the thickness direction.

A semiconductor device includes: a first transformer; a second transformer; a first rectifier chip; a second rectifier chip; and a first frame. Each of the first rectifier chip and the second rectifier chip includes: a first output pad and a second output pad; a semiconductor substrate of a first conductivity type including a first surface; a first semiconductor region of a second conductivity type disposed on the first surface; a first transistor provided in the first semiconductor region and electrically connected to the first output pad; and a second semiconductor region of the second conductivity type provided at a position spaced apart from the first transistor in the first semiconductor region and electrically connected to the second output pad. The second semiconductor region is in contact with the semiconductor substrate. The first rectifier chip and the second rectifier chip are disposed to be spaced apart from each other.

A semiconductor device includes a first chip and a second chip. Each chip includes a high-side pad that receives a high-side voltage, a low-side pad that receives a low-side voltage, two or more control pads, an input pad, an output pad, and a functional circuit. In each chip, the two or more control pads are each pulled down to the low-side voltage or pulled up to the high-side voltage. In each chip, the two or more control pads include a target control pad that receives an external control signal. In each chip, an internal control signal is generated on the basis of two or more signals applied to the two or more control pads, and an operation of the functional circuit is controlled on the basis of the internal control signal.