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案件記録

WAFER INDEXING MECHANISM FOR PROCESS MODULE

発明審査中
4閲覧数
20請求項 · 3 独立
§ Ⅰ

案件概要

IPC分類

H1L 21/67H1L 21/677

CPC分類

H1L21/67196H1L21/67259H1L21/67706

A process module for a process module of a substrate processing system includes a vacuum chamber and a non-vacuum chamber. A substrate support is positioned in the vacuum chamber, is configured to support a substrate incoming into the vacuum chamber, and is coupled to a magnet. A metal component is further positioned to include a motor coil in the non-vacuum chamber. When the motor coil is energized, the motor coil and the magnet interact to generate a magnetic field allowing the substrate support to rotate about a first axis and place the substrate in a desired location. Rotary wafer indexers for process module of substrate processing systems and methods of making substrate indexers are also described.

原文(中国語)

A process module for a process module of a substrate processing system includes a vacuum chamber and a non-vacuum chamber. A substrate support is positioned in the vacuum chamber, is configured to support a substrate incoming into the vacuum chamber, and is coupled to a magnet. A metal component is further positioned to include a motor coil in the non-vacuum chamber. When the motor coil is energized, the motor coil and the magnet interact to generate a magnetic field allowing the substrate support to rotate about a first axis and place the substrate in a desired location. Rotary wafer indexers for process module of substrate processing systems and methods of making substrate indexers are also described.

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