SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

原文（中国語）

A method includes retrieving a first front opening unified pod (FOUP) from a FOUP stocker utilizing an interface module equipped with a transfer module; transporting the retrieved first FOUP via the transfer module across a first path within the interface module to align the first FOUP with an available first load port of a process tool; loading the first FOUP on the first load port; delivering wafers from the first FOUP to the process tool via the first load port to initiate a wafer processing operation using the wafers.