METHOD OF MANUFACTURING INTEGRATED CIRCUIT (IC) DEVICE HAVING STAND-ALONE FEED-THROUGH VIA AND SYSTEM FOR SAME

原文（中国語）

A semiconductor device includes a circuit having a first pin; a first conductor extending in a first direction, the first circuit being between a second conductor and a first side of the first conductor; a circuit having a second pin; and a connection to couple a signal between the first pin and the second pin, the connection including: a first conductive element extending in a second direction, the first conductive element connected to the first pin on the first side of the first conductor; a first via structure connecting the first conductive element to a back of the substrate, including a first feed-through via (FTV) on a second side of the first conductor; a second via structure to provide the signal to a front of the substrate, the second via structure including a second FTV; and a second conductive element connected to the second via structure and the second pin.