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案件記録

RADIO FREQUENCY DEVICES AND METHODS FOR MANUFACTURING THEREOF

発明審査中
1閲覧数
20請求項 · 2 独立
§ Ⅰ

案件概要

発明者

Walter HARTNER; Tuncay ERDÖL; Christian GEISSLER; Ernst SELER

IPC分類

H4B 1/4H4B 1/40

CPC分類

H4B1/483H4B1/40

A radio frequency (RF) device includes a substrate; an RF chip arranged on a first main surface of the substrate; a first coupling element arranged in the substrate and configured to couple an RF signal into or out of the substrate; a second coupling element arranged in the substrate and configured to couple an RF signal into or out of the substrate; a first RF signal path coupling the RF chip and the first coupling element, wherein the first RF signal path is at least partially arranged in the substrate and includes a first section with an RF signal propagation parallel to the first main surface; and a second RF signal path coupling the RF chip and the second coupling element, the second RF signal path including a first section with an RF signal propagation parallel to the first main surface.

原文(中国語)

A radio frequency (RF) device includes a substrate; an RF chip arranged on a first main surface of the substrate; a first coupling element arranged in the substrate and configured to couple an RF signal into or out of the substrate; a second coupling element arranged in the substrate and configured to couple an RF signal into or out of the substrate; a first RF signal path coupling the RF chip and the first coupling element, wherein the first RF signal path is at least partially arranged in the substrate and includes a first section with an RF signal propagation parallel to the first main surface; and a second RF signal path coupling the RF chip and the second coupling element, the second RF signal path including a first section with an RF signal propagation parallel to the first main surface.

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