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案件記録

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

発明審査中
3閲覧数
20請求項 · 3 独立
§ Ⅰ

案件概要

発明者

I-Hsiang MA; Li-Wei YIN; Kai-Min CHIEN; Min-Chia LEE; Kuo-Chin LIU; Yih-Ann LIN; Ryan Chia-Jen CHEN

IPC分類

H1L 29/423H1L 29/6H1L 29/8H1L 29/66H1L 29/775H1L 29/786

CPC分類

H10D30/6735H10D30/14H10D30/43H10D30/6757H10D62/121H10D62/151H10D64/17

Embodiments of the present disclosure provide a semiconductor device structure and methods of forming the same. The structure includes a first semiconductor layer disposed over a substrate, a source/drain region disposed adjacent the first semiconductor layer, a gate spacer disposed over the first semiconductor layer, a native oxide layer disposed between the gate spacer and the source/drain region and between the gate spacer and the first semiconductor layer, a gate dielectric layer disposed between the native oxide layer and the first semiconductor layer, and a gate electrode layer disposed on the gate dielectric layer. The gate electrode layer includes a first portion having a first width and a second portion having a second width greater than the first width.

原文(中国語)

Embodiments of the present disclosure provide a semiconductor device structure and methods of forming the same. The structure includes a first semiconductor layer disposed over a substrate, a source/drain region disposed adjacent the first semiconductor layer, a gate spacer disposed over the first semiconductor layer, a native oxide layer disposed between the gate spacer and the source/drain region and between the gate spacer and the first semiconductor layer, a gate dielectric layer disposed between the native oxide layer and the first semiconductor layer, and a gate electrode layer disposed on the gate dielectric layer. The gate electrode layer includes a first portion having a first width and a second portion having a second width greater than the first width.

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