원래 이름 기록: RTX Corporation

A method of making a component using additive manufacturing (AM) techniques that selecting an AM manufacturing process suitable for making the component; selecting a material for the component that is compatible with the AM manufacturing component; selecting and programming AM process steps into a selected AM apparatus; and building the component on the selected AM apparatus using the selected AM process steps. The AM process steps are selected to produce a plurality of melt pools that reduce material segregation in the finished part. The component exhibits reduced material segregation compared to making the material with a consumable electrode remelting process. The component made with AM techniques includes a region exhibiting reduced material segregation compared to making the material with a consumable electrode remelting process.

An apparatus comprising a plurality of power feeder cables for transferring power between an electrical machine located within an engine core of a hybrid electric gas turbine engine and power controllers located on a fan case of the hybrid electric gas turbine engine. A conduit housing defines an interior for enclosing the plurality of power feeder cables. A first connector connects a first point on the conduit housing to the engine core of the hybrid electric gas turbine engine. A second connector connects a second point on the conduit housing to a trailing edge flange of the hybrid electric gas turbine engine.

A method for laser treating a substrate includes: deforming the substrate to place a portion of a first surface of the substrate in tensile stress; and while holding the substrate deformed, laser treating the portion. After the laser treating but before release of the deformation, the first surface may remain in tensile stress. Release of the deformation then at least partially cancels the tensile stress.

A system for detecting an edge of a substrate, comprising a coated assembly. The coated assembly includes a conductive substrate having at least one edge portion and a dielectric coating coupled along the conductive substrate, the dielectric coating covering the at least one edge portion of the conductive substrate. The system also includes a conductive tool configured to interact with the coated assembly and a substrate sensing system. The substrate sensing system includes a power source coupled with the conductive tool, the coated assembly, and an electrical circuit including the power source and the coated assembly and a sensor configured to sense a change between an open configuration and a closed configuration of the electrical circuit. In an open configuration the conductive tool is engaged with the coated assembly and disengaged from the conductive substrate and in a closed configuration the conductive tool is engaged with the conductive substrate.

A method for grain mapping of a surface of a component includes the steps of constructing a model comprising a three-dimensional scanned model of the component; scanning the component with RGB light to obtain an RGB light scan; applying the RGB light scan to the three-dimensional scanned model of the component to produce a combined three-dimensional model of the component with an RGB light scan overlay on the three-dimensional model; and analyzing the combined three-dimensional model of the component with the RGB light scan overlay on the three-dimensional model to identify grain boundaries in the component.