Metallic Substrate Laser Treatment
개요
발명자
Henry H. Thayer; Elaheh Fattahi Taghaddos; Hamidreza Mohseni; Seung-Yub Lee; David U. Furrer
IPC 분류
CPC 분류
A method for laser treating a substrate includes: deforming the substrate to place a portion of a first surface of the substrate in tensile stress; and while holding the substrate deformed, laser treating the portion. After the laser treating but before release of the deformation, the first surface may remain in tensile stress. Release of the deformation then at least partially cancels the tensile stress.
원문 (중국어)
A method for laser treating a substrate includes: deforming the substrate to place a portion of a first surface of the substrate in tensile stress; and while holding the substrate deformed, laser treating the portion. After the laser treating but before release of the deformation, the first surface may remain in tensile stress. Release of the deformation then at least partially cancels the tensile stress.