Back to Search
Dossier
基于水导激光的水下激光加工设备及水下激光加工方法
InventionActive
10Claims · 2 independent
§ Ⅰ
Dossier Overview
Applicant
长飞光坊(武汉)科技有限公司
Inventor
冯煜哲; 徐祖应; 张丙涛; 贺辉; 柯东
IPC Classification
B23K 26/146 (2014.01)B23K 26/70 (2014.01)
本发明公开了基于水导激光的水下激光加工设备及水下激光加工方法,属于激光加工技术领域,包括激光发生装置、水流发生装置、激光加工头与位移模组,利用激光加工头中激光传输镜组、水室、水导激光管件的集成设置,使得高能激光束可在高压水流柱的导引下准确被导引至水下工件的待加工区域,进而准确实现水下工件的激光加工。本发明中基于水导激光的水下激光加工设备,其结构简单,控制便捷,能够准确实现激光束与高压水流柱的同轴耦合,准确实现水流柱对高能激光束的引导加工,保证水下激光加工的准确性和可靠性,避免激光能量的损耗,扩大了激光水下加工技术的应用范围,降低了激光水下加工技术的应用成本,具有极佳的应用价值和推广前景。
Sign in to read the full text
Claim 1 is shown. Create a free account to read all 10 claims, the full description, all drawings, translations and legal status.
- All claims
- Technical field
- Background
- Summary
- Drawing descriptions
- Detailed description
External Resources