CNIPA.AI
Back to Search
Dossier

HPD模块侧框与基板的自动组装设备

InventionUnknown
10Claims · 1 independent
§ Ⅰ

Dossier Overview

Inventor

唐光明; 江帅; 孙训球

Filing Date

Aug 5, 2026

Publication Date

Oct 16, 2026

IPC Classification

H10P 72/00 (2026.01)B23P 19/06 (2006.01)B23P 19/027 (2006.01)B23P 19/00 (2006.01)H05K 7/14 (2006.01)H05K 5/02 (2006.01)H05K 5/06 (2006.01)H10P 72/30 (2026.01)H10P 74/20 (2026.01)H10P 72/50 (2026.01)H10P 72/76 (2026.01)H10W 76/01 (2026.01)B65G 47/248 (2006.01)B65G 69/16 (2006.01)

本发明涉及半导体功率模块生产设备领域,尤其是HPD模块侧框与基板的自动组装设备。该组装设备包括用于输送并升降装有侧框载盘的花篮的花篮输送提升机构、用于将花篮内的载盘水平拖出至取件位置的侧框载盘水平拖出机构、用于对侧框进行点胶的侧框点胶机构、第一CCD相机、用于输送基板的基板水平输送线、用于将侧框与基板压紧粘结的产品压紧机构、自动打螺丝机、第二CCD相机、用于依次将成品送至自动打螺丝机下方进行锁付、以及送至第二CCD相机下方进行锁付质量检测的电动转盘。本发明从花篮上料、侧框点胶、视觉检测到压紧、翻转、锁付和分拣,实现了HPD模块侧框与基板组装的全自动流水作业,大幅提升了生产效率。

Sign in to read the full text

Claim 1 is shown. Create a free account to read all 10 claims, the full description, all drawings, translations and legal status.

  • All claims
  • Technical field
  • Background
  • Summary
  • Drawing descriptions
  • Detailed description

External Resources