Back to Search
Dossier
光纤接头用灌封材料及其制备方法和应用
InventionUnknown
9Claims · 3 independent
§ Ⅰ
Dossier Overview
Inventor
高召辉; 张帅; 蒋弘谷; 王朝磊
Filing Date
Jul 1, 2026
Publication Date
Oct 20, 2026
IPC Classification
C08L 91/06 (2006.01)B24B 19/22 (2006.01)C08L 93/04 (2006.01)
本发明提出了一种光纤接头用灌封材料及其制备方法和应用，该光纤接头用灌封材料由以下重量份的原料组成：石蜡60‑80份，松香30‑40份。本发明保留石蜡易于熔融清除的本质特性，同时灌封材料固化后邵氏D硬度可达52‑60HD，能够在研磨过程中稳定支撑光纤，成品率提高。
Sign in to read the full text
Claim 1 is shown. Create a free account to read all 9 claims, the full description, all drawings, translations and legal status.
- All claims
- Technical field
- Background
- Summary
- Drawing descriptions
- Detailed description
External Resources