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基于CT三维重建的PCB板缺陷检测方法及系统
InventionUnknown
10Claims · 1 independent
§ Ⅰ
Dossier Overview
Inventor
刘登攀; 黄庆山
Filing Date
Sep 16, 2026
Publication Date
Oct 20, 2026
IPC Classification
G06T 7/00 (2017.01)G06T 17/00 (2006.01)G06V 10/26 (2022.01)G06V 10/422 (2022.01)G06V 10/762 (2022.01)G01N 23/046 (2018.01)
本发明具体为基于CT三维重建的PCB板缺陷检测方法及系统,涉及图像数据处理技术领域,包括:聚类先验例外区域标记为三维体素团簇即缺陷候选区域,由迭代中间体数据逐轮提取三维形态参数组并求形态参数综合变化量;稳定者回授豁免确认指令输出三维形态参数组,波动者回授约束恢复指令。本发明中,按逐视角信噪特性参数与逐视角穿透路径长度对各视角投影数据差异化加权,并按逐体素层分区标记仅在同一结构层内施加匀质约束,同时在每轮重建迭代中由投影残差分量与层内偏离量计算逐体素的先验违背度、使结构约束强度随先验违背度增大而连续减弱,既保证了正常结构区域的稀疏伪影被结构约束充分压制,又防止了疑似缺陷区域的缺陷信号被约束机制抹平。
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