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一种高精密芯片三温测试用晶圆上料机构
InventionUnknown
8Claims · 1 independent
§ Ⅰ
Dossier Overview
Inventor
韩亚林; 周斌; 石小华
Filing Date
Jul 28, 2026
Publication Date
Oct 20, 2026
IPC Classification
H10P 72/00 (2026.01)H10P 72/78 (2026.01)H10P 72/30 (2026.01)H10P 72/76 (2026.01)
本发明涉及芯片测试技术领域，公开了一种高精密芯片三温测试用晶圆上料机构，包括提篮机构、扩膜机构、拉臂机构、夹爪、抓取机构和伸缩件三。本发明通过将抓取机构设计为薄片式结构，包括基板、挤压板及气囊，使得抓取机构能够适应提篮内较小的晶圆环层间间距，顺利伸入相邻晶圆环之间或晶圆环与提篮顶部结构之间的狭窄间隙，从而避免了夹爪直接伸入提篮夹持时与下方晶圆环或提篮顶部发生干涉的问题，显著提高了晶圆环抓取的成功率，尤其适用于晶圆槽间距较小的提篮。
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