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一种用于PCBA电路板的激光焊接装置

InventionUnknown
10Claims · 1 independent
§ Ⅰ

Dossier Overview

Inventor

张荣; 李昕

Filing Date

Sep 16, 2026

Publication Date

Oct 27, 2026

IPC Classification

B23K 1/005 (2006.01)B23K 3/06 (2006.01)B23K 3/08 (2006.01)H05K 3/34 (2026.01)B23K 101/42 (2006.01)

本发明公开了一种用于PCBA电路板的激光焊接装置,属于焊接设备领域,包括底座,所述底座底部的一侧固定连接有立柱,所述立柱的顶部固定连接有伺服电机,所述伺服电机的输出端固定连接有螺纹杆,所述螺纹杆外表面螺纹连接有第一电动滑轨,所述第一电动滑轨的内部滑动连接有第二滑轨。本装置设置S形微型拉力传感器、双驱动轮,锡丝经S型张紧轮导向输送,驱动轮可稳定夹持锡丝不打滑、不压断细线,焊接后可实现锡丝小幅回抽;传感器实时采集输送张力,断锡、堵锡故障可快速联锁停机,有效减少虚焊、锡嘴堵塞、激光空烧等生产不良,送锡精度与运行可靠性大幅提升。

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