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微机电封装
InventionUnknown
20Claims · 1 independent
§ Ⅰ
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Inventor
兰加纳坦·纳加拉佳; 拉玛奇德拉玛尔斯·彼拉迪·叶蕾哈卡; 周国富; 罗希特·普利卡尔·基扎克伊尔
Filing Date
Apr 25, 2025
Publication Date
Oct 27, 2026
IPC Classification
B81B 7/00 (2006.01)B81B 7/02 (2006.01)B81C 1/00 (2006.01)
微机电封装包含第一基板、互连层、微机电元件层、支座结构、键合材料层以及第二基板。互连层设置在第一基板上，微机电元件层包含微机电元件，设置于互连层上方。支座结构设置在微机电元件层下方，围绕微机电元件，且键合至互连层。支座结构包含内侧壁、外侧壁和底面，键合材料层涂布于支座结构的外侧壁和部分的底面上。此外，第二基板包含空腔，且键合至微机电元件层。
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