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一种高密封性多层防水不干胶标签制备工艺
InventionUnknown
10Claims · 1 independent
§ Ⅰ
Dossier Overview
Inventor
何智力
Filing Date
Aug 12, 2026
Publication Date
Oct 27, 2026
IPC Classification
G09F 3/02 (2006.01)C08J 7/12 (2006.01)C08L 67/02 (2006.01)C08L 23/12 (2006.01)C08L 23/06 (2006.01)C09D 175/04 (2006.01)
本申请涉及标签贴纸技术领域,具体公开了一种高密封性多层防水不干胶标签制备工艺,包括如下步骤:表层防水基材表面等离子活化预处理;连续涂布交联密封预聚体,并与阻水阻隔膜进行分段梯度热压复合,在阻水阻隔膜背离密封过渡层的一面涂布改性防水不干胶层;将不干胶层表面贴合离型膜,制得多层防水不干胶卷材;随后在线涂布UV密封料,紫外固化。本申请通过借助交联密封预聚体在两层膜材界面原位交联形成连续密封过渡层,能够填充膜材贴合界面的微观间隙,有效抑制水汽沿层间缝隙向内渗透;同时对模切后的断面实施UV密封固化处理,封堵切口通道,避免水汽发生毛细渗透,实现双重密封结构协同作用。
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