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绕线电阻及其制备方法

InventionUnknown
10Claims · 2 independent
§ Ⅰ

Dossier Overview

Inventor

王福来; 陈磊; 陈秀珠

Filing Date

Sep 17, 2026

Publication Date

Oct 27, 2026

IPC Classification

H01C 3/20 (2006.01)H01C 1/14 (2006.01)H01C 1/01 (2006.01)H01C 1/08 (2006.01)H01C 1/084 (2006.01)H01C 17/04 (2006.01)H01C 17/30 (2006.01)H01C 17/28 (2006.01)

本发明揭示了一种绕线电阻及其制备方法。绕线电阻包括:实心陶瓷棒基体,采用按质量百分数计三氧化二铝含量为80‑85%的原料经烧结而成;合金电阻丝,沿实心陶瓷棒基体的轴向缠绕于实心陶瓷棒基体外表面,首端和末端分别延伸至实心陶瓷棒基体的两端;两个支架引线,其连接端分别连接于实心陶瓷棒基体的两端,自由端沿着实心陶瓷棒基体的径向向远离实心陶瓷棒基体的外侧延伸;合金电阻丝的首端和末端与两个支架引线的连接端电性连接。本发明的绕线电阻,能防止PCB板因局部高温而烧损、碳化或性能劣化,提高PCB板的可靠性和使用寿命;可提高实心陶瓷棒基体的散热效率,降低合金电阻丝工作温升,保证绕线电阻的阻值稳定性和长期可靠性。

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