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层叠电容器

InventionUnknown
7Claims · 1 independent
§ Ⅰ

Dossier Overview

Applicant

深圳丰宾电子半导体科技有限公司

深圳丰宾电子半导体科技有限公司 · View all patentsPatent applicant records

Inventor

陈启瑞; 林金村; 林元瑜; 林薏竹; 罗甲显

Filing Date

Sep 23, 2026

Publication Date

Oct 27, 2026

IPC Classification

H01G 2/20 (2006.01)H01G 2/14 (2006.01)H01G 4/005 (2006.01)H01G 4/30 (2006.01)

本申请提供一种层叠电容器，包括外壳、层叠素子和封口盖。外壳呈长方体状，形成有容置空间，且设置有连通所述容置空间的开口；层叠素子包括层叠设置的阴极基板和阳极基板；所述阳极基板呈矩形，且至少一个角呈光滑自由曲线状；所述层叠素子设置在所述容置空间内；封口盖盖设于所述开口。基于此，本申请的技术方案提高了层叠电容器的可靠性。

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