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一种电极箔及其成卷烧结工艺

InventionUnknown
10Claims · 2 independent
§ Ⅰ

Dossier Overview

Inventor

宋洪洲; 李佳玲

Filing Date

Apr 24, 2025

Publication Date

Oct 27, 2026

IPC Classification

H01G 9/052 (2006.01)H01G 9/00 (2006.01)H01G 9/15 (2006.01)H01G 13/00 (2013.01)

本发明公开了一种电极箔及其成卷烧结工艺,该成卷烧结工艺包括将基层箔与夹层箔间隔卷绕形成箔卷的步骤;所述的夹层箔上开设有微孔。本发明采用的夹层箔上开设有微孔,一方面,在烧结过程中,夹层箔的收缩幅度比未设微孔时要大,与基层箔的收缩幅度更加匹配,有利于减小收卷张力差异,降低排胶困难导致的粘连和鼓包问题;另一方面,微孔可以吸附自基层箔中气化的粘结剂、使其更快挥发,使得排胶更加完全并提高排胶效率;第三方面,具有微孔的夹层箔导热性能更好,如此有利于减小成卷烧结时的箔卷内外温差,降低电极箔各处的电性能差异。

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