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一种曲面基体直接印刷式陶瓷加热体的制备方法

InventionUnknown
10Claims · 2 independent
§ Ⅰ

Dossier Overview

Inventor

吴宝洲; 柯建家; 蔡毅; 阙丹龙; 陈森; 郑志敏

Filing Date

Jun 26, 2026

Publication Date

Oct 27, 2026

IPC Classification

H05B 3/14 (2006.01)B41M 1/34 (2006.01)B41M 5/00 (2006.01)B41M 7/00 (2006.01)B28B 3/20 (2006.01)B28B 11/24 (2006.01)B24B 1/00 (2006.01)B24B 55/06 (2006.01)C04B 35/66 (2006.01)C04B 35/10 (2006.01)C04B 35/622 (2006.01)

本发明公开了一种曲面基体直接印刷式陶瓷加热体的制备方法,属于陶瓷电热元件加工技术领域。本发明以完全高温烧结的氧化铝或ZTA陶瓷圆棒为加工基底,经抛光、清洗、活化预处理后,采用曲面移印工艺在基体端部异形区域成型5~20μm厚膜导电电极,再通过压电喷墨直印工艺在陶瓷曲面制备50~300μm高精度发热线路,经120~200℃低温分段固化成型。本发明摒弃传统平面印刷二次贴合工艺,消除粘接复合界面,工艺流程简化,线路与基体结合强度提升;且端部厚膜电极导电可靠性强,无冷热循环分层风险,可支撑内嵌钎焊电极装配,适配多规格陶瓷加热体高效量产。

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