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基于过渡金属层的玻璃通孔填充方法及玻璃基板
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13Claims · 2 independent
§ Ⅰ
Dossier Overview
Inventor
任金枝; 李晶晶; 徐业海; 王永龙; 刘旭; 左国军
Filing Date
Aug 21, 2026
Publication Date
Oct 27, 2026
IPC Classification
H10W 70/05 (2026.01)H10W 70/66 (2026.01)H10W 70/63 (2026.01)H10P 14/40 (2026.01)H10P 14/47 (2026.01)
本发明公开了基于过渡金属层的玻璃通孔填充方法及玻璃基板，包括以下步骤：提供具有通孔的玻璃基板；对通孔进行清洗及孔壁活化处理；在通孔的内壁制备过渡金属层；对通孔进行电镀填孔；对玻璃基板进行平坦化处理。本发明在通孔内壁制备过渡金属层以衔接玻璃基体与后续填充金属，有效缓解热失配引发的界面分层风险、保障高深宽比通孔导电通路连续性，同时适配规模化量产需求，显著降低工艺成本与设备投入。
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