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玻璃通孔填充方法及玻璃基板
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15Claims · 2 independent
§ Ⅰ
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Inventor
任金枝; 李晶晶; 徐业海; 王永龙; 刘旭; 左国军
Filing Date
Aug 21, 2026
Publication Date
Oct 27, 2026
IPC Classification
H10W 70/05 (2026.01)H10W 70/63 (2026.01)H10W 70/66 (2026.01)H10P 14/40 (2026.01)H10P 14/46 (2026.01)
本发明公开了玻璃通孔填充方法及玻璃基板，玻璃通孔填充方法包括以下步骤：提供具有通孔的玻璃基板；对通孔进行清洗及孔壁活化处理；将导电胶设置于通孔内；对设置有导电胶的玻璃基板进行抽真空处理；对导电胶进行热固化，以在通孔内形成导电胶填充层；对玻璃基板进行平坦化处理。本发明采用导电胶填充结合抽真空排气、热固化的工艺，在实现通孔无空洞高质量填充的同时，大幅放宽工艺窗口、降低制造成本。
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