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一种晶圆植球装置
InventionUnknown
10Claims · 1 independent
§ Ⅰ
Dossier Overview
Inventor
刘泽洋; 董达阳; 邵先情
Filing Date
Aug 13, 2026
Publication Date
Oct 27, 2026
IPC Classification
H10W 72/00 (2026.01)
本申请公开一种晶圆植球装置，涉及半导体封装设备的技术领域，其包括机架、网板、移动组件和收球组件；网板设置在机架上，网板上设置有网孔，网孔用于使锡球落入晶圆上；移动组件设置在机架上；收球组件包括支撑座、收球连接座、收球板和回收件；支撑座设置在移动组件上，收球连接座设置在支撑座上，收球板设置在收球连接座上；移动组件用于带动支撑座移动，使收球板推动锡球移动至网孔的范围内；回收件用于将收球板两侧的锡球转运至收球板的移动路径内。本申请具有提高晶圆植球效率，并降低生产成本的效果。
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