Dossier

SOLDER ALLOY, SOLDER BALL, SOLDER PREFORM, SOLDER JOINT, AND CIRCUIT

InventionPending

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§ Ⅰ

Dossier Overview

Applicant

Senju Metal Industry Co., Ltd.

Inventor

SUGISAWA, Kota; IIJIMA, Yuki; YOSHIKAWA, Shunsaku

Filing Date

Apr 18, 2024

Publication Date

Jan 6, 2026

IPC Classification

B23KC22CH05K

CPC Classification

C22CH05KB23K

External Resources