Dossier

FILM, LAMINATE AND PRECURSOR COMPOSITION, AND COMPOSITION FOR LOWERING THERMAL EXPANSION COEFFICIENT OF POLYIMIDE RESIN

InventionPending

§ Ⅰ

Dossier Overview

Applicant

I.S.T Corporation

Inventor

MATSUBAYASHI, Hidetada; MORIUCHI, Koji

Filing Date

Feb 21, 2024

Publication Date

Jan 6, 2026

IPC Classification

C08JB32BB32BC08KC08LH05KH05K

CPC Classification

B32BB32BC08JC08KC08LH05KH05K

External Resources