Dossier

SENSOR HOUSING ASSEMBLY FOR MULTIPLE MOUNTING INTERFACES AND CONFIGURATIONS

InventionPending

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§ Ⅰ

Dossier Overview

Applicant

Honeywell International Inc.

Inventor

YEE, Daniel James; CROSS, Karina E.; MORAN, Michael; MYERS, Ronald W.

Filing Date

May 27, 2025

Publication Date

Jan 6, 2026

IPC Classification

G01DG01D

CPC Classification

G01DG01DG01KG01F

External Resources