Dossier

DOUBLE-SIDED MULTICHIP PACKAGES WITH DIRECT DIE-TO-DIE COUPLING

InventionPending

§ Ⅰ

Dossier Overview

Applicant

NXP USA, Inc.

Inventor

Vincent, Michael B; Hayes, Scott M; Gong, Zhiwei

Filing Date

Jun 11, 2025

Publication Date

Jan 6, 2026

IPC Classification

H01LH01LH01LH01LH01LH01LH01LH01L

CPC Classification

H01LH01LH01LH01LH01LH01LH01LH01LH01LH01LH01LH01LH01LH01LH01L2225/06524

External Resources