INTEGRATED CIRCUIT COOLING UTILIZING WIRE BONDING ON METALLIZED LAYER

Applicant

Google LLC

Inventor

DE KOCK, Konrad; TANG, Yingshi; SAMADIANI, Emad; WANG, Yingying; UDHAYAKUMAR, Sudharshan Sugavanesh; MADHUSUDAN, Iyengar K.

Filing Date

Jun 17, 2025

Publication Date

Jan 6, 2026