Dossier

반도체 패키지

Inventionpatent.status.granted

8views

§ Ⅰ

Dossier Overview

Applicant

Inventor

문경돈; 강명삼; 고영찬; 권이억; 김정석; 이공제; 조봉주

Filing Date

Aug 25, 2020

Publication Date

Dec 31, 2025

IPC Classification

H1L 23/528H1L 23/H1L 23/31H1L 23/367H1L 23/48H1L 23/485H1L 23/498

CPC Classification

H1L23/528H1L23/31H1L23/367H1L23/367H1L23/481H1L23/485H1L23/49816H1L23/525H1L24/14

External Resources