MODIFIED OBJECT AND MANUFACTURING METHOD THEREOF
Dossier Overview
Applicant
GlobalWafers Co., Ltd.
Inventor
Chung-Wei Cheng; Ying-Ru Shih; Jia-Fan Kuo; Bo-Kai Wang
IPC Classification
CPC Classification
A modified object includes a single crystal substrate, an internal modification trace and a surface processing trace. The single crystal substrate has a first surface and a second surface facing away from the first surface. The first surface and the second surface of the single crystal substrate are arranged in a thickness direction of the single crystal substrate. The internal modification trace is formed between the first surface and the second surface of the single crystal substrate. The surface processing trace are formed on the second surface of the single crystal substrate. The internal modification trace and the surface processing trace overlap in the thickness direction of the single crystal substrate. In addition, a method for manufacturing the modified object is also provided.
Original (Chinese)
A modified object includes a single crystal substrate, an internal modification trace and a surface processing trace. The single crystal substrate has a first surface and a second surface facing away from the first surface. The first surface and the second surface of the single crystal substrate are arranged in a thickness direction of the single crystal substrate. The internal modification trace is formed between the first surface and the second surface of the single crystal substrate. The surface processing trace are formed on the second surface of the single crystal substrate. The internal modification trace and the surface processing trace overlap in the thickness direction of the single crystal substrate. In addition, a method for manufacturing the modified object is also provided.
External Resources