Bridge For A Laser Processing Machine
Dossier Overview
Applicant
Bystronic Laser AG
Inventor
Christian Kähr; Peter Schmutz; Fabian Bürgi
IPC Classification
CPC Classification
This disclosure relates to a bridge for a laser processing machine that includes a support extending along a first axis and a receiving side for movably guiding a laser processing unit along the first axis., One or more guide means are provided on the bridge for movably guiding the bridge along a second axis which runs essentially perpendicular to the first axis. Each guide means is provided in a separate support component which is detachably connected to the carrier and has a support surface on which the carrier rests with a contact surface. The support surface runs perpendicular to the receiving side and is inclined at an angle of inclination relative to the second axis, such that the support surface, with increasing distance from the receiving side of the bridge, approaches a base of the support component, which faces away from the support surface.
Original (Chinese)
This disclosure relates to a bridge for a laser processing machine that includes a support extending along a first axis and a receiving side for movably guiding a laser processing unit along the first axis., One or more guide means are provided on the bridge for movably guiding the bridge along a second axis which runs essentially perpendicular to the first axis. Each guide means is provided in a separate support component which is detachably connected to the carrier and has a support surface on which the carrier rests with a contact surface. The support surface runs perpendicular to the receiving side and is inclined at an angle of inclination relative to the second axis, such that the support surface, with increasing distance from the receiving side of the bridge, approaches a base of the support component, which faces away from the support surface.
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