POLYIMIDE PRECURSOR COMPOSITION, POLYIMIDE FILM, LAMINATE, ELECTRONIC DEVICE, METHOD OF PRODUCING LAMINATE, METHOD OF PRODUCING POLYIMIDE FILM, AND METHOD OF PRODUCING ELECTRONIC DEVICE
Dossier Overview
Applicant
KANEKA CORPORATION
Inventor
Hirofumi Nakayama; Masayoshi Kido; Nobuaki Tanaka
IPC Classification
CPC Classification
A polyimide precursor composition contains a polyimide precursor and an organic solvent. The polyimide precursor has a structural unit into which a specific xanthene structure has been introduced. The imidization ratio of the polyimide precursor is 10 mol % or more and 100 mol % or less. The organic solvent may be one or more solvents selected from N-methyl-2-pyrrolidone, 1-butyl-2-pyrrolidone, 3-methoxy-N,N-dimethylpropanamide, 3-butoxy-N,N-dimethylpropanamide, N,N-dimethylpropionamide, N,N-diethylformamide and 1,3-dimethyl-2-imidazolidinone.
Original (Chinese)
A polyimide precursor composition contains a polyimide precursor and an organic solvent. The polyimide precursor has a structural unit into which a specific xanthene structure has been introduced. The imidization ratio of the polyimide precursor is 10 mol % or more and 100 mol % or less. The organic solvent may be one or more solvents selected from N-methyl-2-pyrrolidone, 1-butyl-2-pyrrolidone, 3-methoxy-N,N-dimethylpropanamide, 3-butoxy-N,N-dimethylpropanamide, N,N-dimethylpropionamide, N,N-diethylformamide and 1,3-dimethyl-2-imidazolidinone.
External Resources