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ADHESIVE COMPOSITION, METHOD OF MANUFACTURING ADHESIVE LAYER, AND ELECTRONIC DEVICE

InventionPending
3views
20Claims · 3 independent
§ Ⅰ

Dossier Overview

Inventor

HYUNJUNG LEE; WON-SEOK KIM; KANG-WOO LEE; Dasong LEE

IPC Classification

C9J 153/C8F 293/H5K 5/3

CPC Classification

C9J153/C8F293/H5K5/3C8F2810/20

An adhesive composition includes a compound including a repeating unit derived from an acrylate monomer and an additive including a photoinitiator. As a terminal of the compound included in the adhesive composition is cured and a crosslinking structure is formed, volume change of a compound forming an adhesive layer is reduced, thereby preventing bubbles from penetrating into the adhesive layer from outside.

Original (Chinese)

An adhesive composition includes a compound including a repeating unit derived from an acrylate monomer and an additive including a photoinitiator. As a terminal of the compound included in the adhesive composition is cured and a crosslinking structure is formed, volume change of a compound forming an adhesive layer is reduced, thereby preventing bubbles from penetrating into the adhesive layer from outside.

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