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기록
TWO-COMPONENT THERMALLY-CONDUCTIVE STRUCTURAL ADHESIVE
발명심사 중
1조회수
15청구항 · 1 독립항
§ Ⅰ
개요
출원인
DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
발명자
Felix KOCH; Beda STEINER
IPC 분류
C9J 163/C9J 9/C9J 11/6C9J 11/8
CPC 분류
C9J163/C9J9/C9J11/6C9J11/8C9J2400/20C9J2475/
Provided herein is a two-component thermally-conductive epoxy adhesive.
원문 (중국어)
Provided herein is a two-component thermally-conductive epoxy adhesive.