HOMOEPITAXIAL THIN FILM, MANUFACTURING METHOD AND MANUFACTURING APPARATUS THEREOF
Dossier Overview
Applicant
Shincron Co., Ltd.
Inventor
Yosuke INASE; Suguru SAITO; Mitsuhito ENDO; Toshiya MIYAZAKI
IPC Classification
CPC Classification
In order to form a homoepitaxial thin film on the surface of a substrate having LiNbOsingle crystal or LiTaOsingle crystal surface, a composition identical to that of the single crystal is formed by a high-frequency sputtering method on the surface of the substrate having LiNbOsingle crystal or LiTaOsingle crystal surface. Manufacturing apparatus for a homoepitaxial thin film includes a chamber and a high-frequency power source that supplies high-frequency power to a target disposed inside the chamber. Sputtering electrode is arranged such that a surface normal of the target is offset with respect to the substrate located at a film formation position, and is also arranged such that the surface normal of the target is inclined at an angle of 15° to 75° with respect to a surface normal of the substrate.
Original (Chinese)
In order to form a homoepitaxial thin film on the surface of a substrate having LiNbOsingle crystal or LiTaOsingle crystal surface, a composition identical to that of the single crystal is formed by a high-frequency sputtering method on the surface of the substrate having LiNbOsingle crystal or LiTaOsingle crystal surface. Manufacturing apparatus for a homoepitaxial thin film includes a chamber and a high-frequency power source that supplies high-frequency power to a target disposed inside the chamber. Sputtering electrode is arranged such that a surface normal of the target is offset with respect to the substrate located at a film formation position, and is also arranged such that the surface normal of the target is inclined at an angle of 15° to 75° with respect to a surface normal of the substrate.
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