METHOD AND SYSTEM OF CORRECTING OPTICAL PROXIMITY CORRECTION (OPC) MODEL FOR MANUFACTURING SEMICONDUCTOR DEVICE

原文（中国語）

A method of training model for manufacturing a semiconductor device is provided. Training image data is collected from at least two wafer images on a same wafer. A metrology error function is determined according to the contour difference between at least two wafer images. A metrology-aware correction model including an optical proximity correction (OPC) model and a metrology model is trained based on the metrology error function associated with the metrology model, to obtain a trained OPC model and a trained metrology model.