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MULTILAYER ELECTRONIC COMPONENT

InventionPending
1views
12Claims · 1 independent
§ Ⅰ

Dossier Overview

Inventor

Hisashi SATO; Tatsuya SUZUKI; Daiki TSURUBAYASHI; Tomoyuki MIWA

IPC Classification

H1G 4/8H1G 4/12H1G 4/232H1G 4/248H1G 4/30

CPC Classification

H1G4/8H1G4/12H1G4/232H1G4/248H1G4/30

A multilayer electronic component includes a multilayer body including inner electrodes and dielectric layers alternately stacked, underlying electrodes, and outer electrodes. The inner electrodes include first inner electrodes and second inner electrodes. The underlying electrodes include a first underlying electrode and a second underlying electrode. The outer electrodes include a first outer electrode and a second outer electrode. The first underlying electrode and the second underlying electrode each include multiple sintered bodies composed of dielectric particles. At least part of the multiple sintered bodies are located on an interface between each underlying electrode and the multilayer body.

Original (Chinese)

A multilayer electronic component includes a multilayer body including inner electrodes and dielectric layers alternately stacked, underlying electrodes, and outer electrodes. The inner electrodes include first inner electrodes and second inner electrodes. The underlying electrodes include a first underlying electrode and a second underlying electrode. The outer electrodes include a first outer electrode and a second outer electrode. The first underlying electrode and the second underlying electrode each include multiple sintered bodies composed of dielectric particles. At least part of the multiple sintered bodies are located on an interface between each underlying electrode and the multilayer body.

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