LOW THERMAL BUDGET LASER ANNEALING
Dossier Overview
Applicant
Applied Materials, Inc.
Inventor
Shashank SHARMA; Nicolas Louis BREIL; Liu JIANG
IPC Classification
CPC Classification
The embodiments herein provide thermal processing apparatus. The thermal processing apparatus includes a radiation module configured to generate a line of radiation for an annealing process, a substrate support configured to receive a substrate thereon, and a translation mechanism. The substrate support includes one or more channels configured to flow a working fluid therethrough. The working fluid is configured to enable a bottom surface of the substrate disposed upon the substrate support to be cooled to a temperature of about 200° C. to about −200° C. during the annealing process. The translation mechanism is configured to translate the substrate support and the line of radiation relative to one another.
Original (Chinese)
The embodiments herein provide thermal processing apparatus. The thermal processing apparatus includes a radiation module configured to generate a line of radiation for an annealing process, a substrate support configured to receive a substrate thereon, and a translation mechanism. The substrate support includes one or more channels configured to flow a working fluid therethrough. The working fluid is configured to enable a bottom surface of the substrate disposed upon the substrate support to be cooled to a temperature of about 200° C. to about −200° C. during the annealing process. The translation mechanism is configured to translate the substrate support and the line of radiation relative to one another.
External Resources