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案件記録

SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD USING THE SAME

発明審査中
20請求項 · 3 独立
§ Ⅰ

案件概要

IPC分類

H1L 21/66H1L 21/78

CPC分類

H1L22/12H1L21/78

Provided are substrate processing systems and substrate processing methods. A substrate processing method includes grinding a back side of a substrate, attaching a die attach film to the substrate that is ground, and inspecting the substrate. Inspecting the substrate includes using a vision camera to inspect a surface of the substrate, and using an infrared laser device to inspect an interior of the substrate.

原文(中国語)

Provided are substrate processing systems and substrate processing methods. A substrate processing method includes grinding a back side of a substrate, attaching a die attach film to the substrate that is ground, and inspecting the substrate. Inspecting the substrate includes using a vision camera to inspect a surface of the substrate, and using an infrared laser device to inspect an interior of the substrate.

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