MICROELECTRONIC DEVICE
Dossier Overview
Applicant
VisEra Technologies Company Ltd.
Inventor
Wen-Yu SHIH; Chin-Ching CHANG; Yi-Hua CHIU
IPC Classification
CPC Classification
An microelectronic device includes a semiconductor substrate, at least one sensing element disposed in the semiconductor substrate, at least one multi-film stack disposed on the semiconductor substrate and covering the sensing element, a refill layer disposed on the semiconductor substrate and encircling the multi-film stack, and a spacer layer disposed on the multi-film stack and the refill layer. An area of a top surface of the multi-film stack is less than an area of a bottom surface of the multi-film stack. The multi-film stack has a first dimension measured in a direction, a section of the refill layer has a second dimension measured in the direction, and a ratio of the second dimension to the first dimension is in a range from 0.03 to 0.06. The refill layer and the spacer layer are organic layers.
Original (Chinese)
An microelectronic device includes a semiconductor substrate, at least one sensing element disposed in the semiconductor substrate, at least one multi-film stack disposed on the semiconductor substrate and covering the sensing element, a refill layer disposed on the semiconductor substrate and encircling the multi-film stack, and a spacer layer disposed on the multi-film stack and the refill layer. An area of a top surface of the multi-film stack is less than an area of a bottom surface of the multi-film stack. The multi-film stack has a first dimension measured in a direction, a section of the refill layer has a second dimension measured in the direction, and a ratio of the second dimension to the first dimension is in a range from 0.03 to 0.06. The refill layer and the spacer layer are organic layers.
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