THERMALLY EFFICIENT INTEGRATED DEVICE
개요
발명자
David Coenen; Herman Oprins; Joris Van Campenhout; Peter Verheyen; Yoojin Ban; Minkyu Kim; Filippo Jacopo Ferraro; Robert Miller; Philippe Absil; Dimitrios Velenis
IPC 분류
CPC 분류
Electronic-photonic systems including an integrated device, and methods for manufacturing the integrated device, are provided. In one aspect, the integrated device includes an electronic integrated circuit (EIC) and a photonic integrated circuit (PIC) bonded and electrically connected to the EIC. The PIC includes a waveguide and a heater configured to heat the waveguide. The integrated device includes one or more cavities arranged between the heater and the EIC for thermally isolating the heater from the EIC.
원문 (중국어)
Electronic-photonic systems including an integrated device, and methods for manufacturing the integrated device, are provided. In one aspect, the integrated device includes an electronic integrated circuit (EIC) and a photonic integrated circuit (PIC) bonded and electrically connected to the EIC. The PIC includes a waveguide and a heater configured to heat the waveguide. The integrated device includes one or more cavities arranged between the heater and the EIC for thermally isolating the heater from the EIC.