METHOD INCLUDING BONDING A DIE TO A BONDING SITE AND A BONDING APPARATUS FOR CARRYING OUT THE METHOD

Original (Chinese)

In an implementation, a method can include creating a first edge in a workpiece that includes a die and a dicing lane adjacent to the die, wherein the first edge extends to at least the dicing lane. The method can further include dicing the workpiece to separate the die from a remainder of the workpiece, wherein dicing forms an outer peripheral edge and is performed after creating the first edge, and bonding the die to a bonding site, wherein, during bonding, the outer peripheral edge does not contact an object. In another implementation, the bonding substrate can comprise a trench, and the die may or may not have an edge. In both methods, outer peripheral edges of the die may not contact any object during a bonding transfer cycle. A bonding apparatus can be adapted to carry out the method.